Interconnect Apparatus and Method

ABSTRACT

A method includes bonding a first semiconductor chip on a second semiconductor chip, applying an etching process to the first semiconductor chip and the second semiconductor chip until a metal surface of the second semiconductor chip is exposed, wherein as a result of applying the etching process, an opening is formed in the first semiconductor chip and the second semiconductor chip and plating a conductive material in the opening to from a conductive plug.

PRIORITY CLAIM AND CROSS-REFERENCE

This is a continuation application of U.S. application Ser. No.15/395,360, entitled “Interconnect Apparatus and Method” which was filedon Dec. 30, 2016 which is a divisional application of U.S. applicationSer. No. 13/890,841, entitled “Interconnect Apparatus and Method” whichwas filed on May 9, 2013 and issued as U.S. Pat. No. 9,536,777 on Jan.3, 2017, which claims priority to U.S. Provisional Application Ser. No.61/780,465, entitled “Interconnect Apparatus and Method” which was filedon Mar. 13, 2013, all of which are incorporated herein by reference.

BACKGROUND

The semiconductor industry has experienced rapid growth due tocontinuous improvements in the integration density of a variety ofelectronic components (e.g., transistors, diodes, resistors, capacitors,etc.). For the most part, this improvement in integration density hascome from repeated reductions in minimum feature size (e.g., shrink thesemiconductor process node towards the sub-20 nm node), which allowsmore components to be integrated into a given area. As the demand forminiaturization, higher speed and greater bandwidth, as well as lowerpower consumption and latency has grown recently, there has grown a needfor smaller and more creative packaging techniques of semiconductordies.

As semiconductor technologies further advance, stacked semiconductordevices have emerged as an effective alternative to further reduce thephysical size of a semiconductor device. In a stacked semiconductordevice, active circuits such as logic, memory, processor circuits andthe like are fabricated on different semiconductor wafers. Two or moresemiconductor wafers may be installed on top of one another to furtherreduce the form factor of the semiconductor device.

Two semiconductor wafers may be bonded together through suitable bondingtechniques. The commonly used bonding techniques include direct bonding,chemically activated bonding, plasma activated bonding, anodic bonding,eutectic bonding, glass frit bonding, adhesive bonding,thermo-compressive bonding, reactive bonding and/or the like. Once twosemiconductor wafers are bonded together, the interface between twosemiconductor wafers may provide an electrically conductive path betweenthe stacked semiconductor wafers.

One advantageous feature of stacked semiconductor devices is much higherdensity can be achieved by employing stacked semiconductor devices.Furthermore, stacked semiconductor devices can achieve smaller formfactors, cost-effectiveness, increased performance and lower powerconsumption.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a cross sectional view of a stacked semiconductordevice prior to a bonding process in accordance with various embodimentsof the present disclosure;

FIG. 2 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 1 after a bottom anti-reflection coating (BARC) layer anda plurality of hard mask layers are formed over the first semiconductorwafer in accordance with various embodiments of the present disclosure;

FIG. 3 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 2 after a patterning process is applied to the hard masklayers and the BARC layer of the first semiconductor wafer in accordancewith various embodiments of the present disclosure;

FIG. 4 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 3 after an etching process is applied to the substrate ofthe first semiconductor wafer in accordance with various embodiments ofthe present disclosure;

FIG. 5 illustrates a cross section view of the semiconductor deviceshown in FIG. 4 after another etching process is applied to thesemiconductor device in accordance with various embodiments of thepresent disclosure;

FIG. 6 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 5 after the remaining photoresist layer has been removedin accordance with various embodiments of the present disclosure;

FIG. 7 illustrates a cross section view of the semiconductor deviceshown in FIG. 6 after a dielectric layer is deposited over thesemiconductor device in accordance with various embodiments of thepresent disclosure;

FIG. 8 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 7 after an etching process is applied to some portions ofthe dielectric layer in accordance with in accordance with variousembodiments of the present disclosure;

FIG. 9 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 6 after a conductive material has been filled in theopenings in accordance with various embodiments of the presentdisclosure;

FIG. 10 illustrates a cross section view of the semiconductor deviceshown in FIG. 9 after a chemical mechanical polish (CMP) process isapplied to the top surface of the semiconductor device in accordancewith various embodiments of the present disclosure;

FIG. 11 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 10 after a dielectric layer is formed on the semiconductordevice in accordance with various embodiments of the present disclosure;

FIG. 12 illustrates a cross sectional view of another stackedsemiconductor device in accordance with various embodiments of thepresent disclosure;

FIG. 13 illustrates a cross sectional view of yet another stackedsemiconductor device in accordance with various embodiments of thepresent disclosure;

FIG. 14 illustrates a cross sectional view of a backside illuminatedimager sensor including a stacked wafer structure in accordance withvarious embodiments of the present disclosure;

FIG. 15 illustrates a top view of the hard mask in accordance withvarious embodiments of the present disclosure; and

FIG. 16 illustrates another top view of the hard mask in accordance withvarious embodiments of the present disclosure.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the variousembodiments and are not necessarily drawn to scale.

DETAILED DESCRIPTION

The making and using of the presently preferred embodiments arediscussed in detail below. It should be appreciated, however, that thepresent invention provides many applicable inventive concepts that canbe embodied in a wide variety of specific contexts. The specificembodiments discussed are merely illustrative of specific ways to makeand use the invention, and do not limit the scope of the invention.

The present invention will be described with respect to preferredembodiments in a specific context, a method for forming interconnectstructures for a stacked semiconductor device. The invention may also beapplied, however, to a variety of semiconductor devices. Hereinafter,various embodiments will be explained in detail with reference to theaccompanying drawings.

FIG. 1 illustrates a cross sectional view of a stacked semiconductordevice prior to a bonding process in accordance with various embodimentsof the present disclosure. Both the first semiconductor wafer 110 andthe second semiconductor wafer 210 include a semiconductor substrate(e.g., first substrate 102 and second substrate 202) and a plurality ofinterconnect structures (e.g., metal lines 106, 108, 206 and 208) formedover the semiconductor substrate. The first semiconductor wafer 110 isused as an example to illustrate the detailed structure of thesemiconductor wafers prior to a bonding process.

As shown in FIG. 1, the first semiconductor wafer 110 may comprises afirst substrate 102 and a plurality of inter-metal dielectric layers 104formed over the first substrate 102. In addition, a plurality of metallines such as metal lines 106 and 108 are formed in the inter-metaldielectric layers 104.

The first substrate 102 may be formed of silicon, although it may alsobe formed of other group III, group IV, and/or group V elements, such assilicon, germanium, gallium, arsenic, and combinations thereof. Thefirst substrate 102 may also be in the form of silicon-on-insulator(SOI). The SOI substrate may comprise a layer of a semiconductormaterial (e.g., silicon, germanium and/or the like) formed over aninsulator layer (e.g., buried oxide and/or the like), which is formed ina silicon substrate. In addition, other substrates that may be usedinclude multi-layered substrates, gradient substrates, hybridorientation substrates, any combinations thereof and/or the like.

The first substrate 102 may further comprise a variety of electricalcircuits (not shown). The electrical circuits formed on the firstsubstrate 102 may be any type of circuitry suitable for a particularapplication. In accordance with some embodiments, the electricalcircuits may include various n-type metal-oxide semiconductor (NMOS)and/or p-type metal-oxide semiconductor (PMOS) devices such astransistors, capacitors, resistors, diodes, photo-diodes, fuses and/orthe like.

The electrical circuits may be interconnected to perform one or morefunctions. The functions may include memory structures, processingstructures, sensors, amplifiers, power distribution, input/outputcircuitry and/or the like. One of ordinary skill in the art willappreciate that the above examples are provided for illustrativepurposes only and are not intended to limit the various embodiments toany particular applications.

The inter-metal dielectric layers 104 are formed over the firstsubstrate 102. As shown in FIG. 1, the inter-metal dielectric layers 104may comprise a plurality of metal lines such as metal lines 106 and 108.

The metal lines 106 and 108 may be made through any suitable formationprocess (e.g., lithography with etching, damascene, dual damascene, orthe like) and may be formed using suitable conductive materials such ascopper, aluminum, aluminum alloys, copper alloys or the like.

As shown in FIG. 1, the first semiconductor wafer 110 will be stacked ontop of the second semiconductor wafer 210. In some embodiments, aplurality of bonding pads are formed in the first semiconductor wafer110 and the second semiconductor wafer 210 respectively. Furthermore,the bonding pads located at the second semiconductor wafer 210 arealigned face-to-face with their corresponding bonding pads located atthe first semiconductor wafer 110. The first semiconductor wafer 110 andthe second semiconductor wafer 210 are bonded together through suitablebonding techniques such as direct bonding.

In accordance with some embodiments, in a direct bonding process, theconnection between the first semiconductor wafer 110 and the secondsemiconductor wafer 210 can be implemented through metal-to-metalbonding (e.g., copper-to-copper bonding), dielectric-to-dielectricbonding (e.g., oxide-to-oxide bonding), metal-to-dielectric bonding(e.g., oxide-to-copper bonding), any combinations thereof and/or thelike.

It should be noted that the bonding show in FIG. 1 may be at waferlevel. In the wafer-level bonding, wafers 110 and 210 are bondedtogether, and are then sawed into dies. Alternatively, the bonding maybe performed at the chip level.

It should further be noted that the first semiconductor wafer 110 may bea backside illumination sensor and the second semiconductor wafer 210may be a logic circuit. The backside illuminated image sensor may beformed in an epitaxial layer over a silicon substrate. According to thefabrication process of backside illuminated image sensors, the siliconsubstrate has been removed in a backside thinning process. A portion ofepitaxial layer remains. A photo active region is formed in theremaining epitaxial layer.

The photo active regions may comprise, for example, photo-diodes formedby implanting impurity ions into the epitaxial layer. Furthermore, thephoto active regions may be a PN junction photo-diode, a PNPphoto-transistor, an NPN photo-transistor or the like. In accordancewith an embodiment, the photo active regions may comprise a p-type layerformed on an n-type region, wherein the n-type region is formed on anepitaxial layer grown from a p-type semiconductor substrate.

The second semiconductor wafer 210 may comprise a logic circuit. Thelogic circuit may be an analog-to-digital converter. In addition, thelogic circuit may be a data processing circuit, various embodiments mayalso include other circuits connected to a backside illuminated imagesensor, such as a memory circuit, a bias circuit, a reference circuitand the like.

After the first semiconductor wafer 110 is bonded on the secondsemiconductor wafer 210, a thinning process may be applied to thebackside of the first semiconductor wafer in accordance with anembodiment. According to the fabrication processes of backsideilluminated image sensors, the substrate is thinned until the epitaxiallayer is exposed. More particularly, the backside the substrate may bethinned to a thickness in a range from about 2 um to about 2.15 um. Sucha thin substrate layer allows light to pass through the substrate andhit photo diodes embedded in the substrate without being absorbed by thesubstrate.

The thinning process may be implemented by using suitable techniquessuch as grinding, polishing and/or chemical etching. In accordance withan embodiment, the thinning process may be implemented by using achemical mechanical polishing (CMP) process. In a CMP process, acombination of etching materials and abrading materials are put intocontact with the back side of the substrate and a grinding pad (notshown) is used to grind away the back side of the substrate until adesired thickness is achieved

FIG. 2 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 1 after a bottom anti-reflection coating (BARC) layer anda plurality of hard mask layers are formed over the first semiconductorwafer in accordance with various embodiments of the present disclosure.The BARC layer 112 is formed on a backside of the first substrate 102.Throughout the description, the side of the first substrate 102 adjacentto the BARC layer 112 is referred to the backside of the first substrate102.

The BARC layer 112 may be formed of a nitride material, an organicmaterial, an oxide material and the like. The BARC layer 112 may beformed using suitable techniques such as chemical vapor deposition (CVD)and/or the like.

A first hard mask layer 113 is formed over the BARC layer 112. A secondhard mask layer 115 is formed over the first hard mask layer 113. Insome embodiments, the first hard mask layer 113 may be formed ofpolysilicon. The second hard mask layer 115 is formed of oxide.Throughout the description, the first hard mask layer 113 isalternatively referred to as a poly hard mask layer 113. The second hardmask layer 115 is alternatively referred to as an oxide hard mask layer115. The poly and oxide hard mask layers may be formed using suitabletechniques such as CVD and/or the like.

FIG. 3 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 2 after a patterning process is applied to the hard masklayers and the BARC layer of the first semiconductor wafer in accordancewith various embodiments of the present disclosure. A patterned mask 302such as a photoresist mask and/or the like may be formed over the oxidehard mask layer 115 using suitable deposition and photolithographytechniques. A suitable etching process, such as a reactive ion etch(RIE) or other dry etch, an anisotropic wet etch, or any other suitableanisotropic etch or patterning process may be applied to the hard masklayers and the BARC layer. As a result, a plurality of openings 301 and303 are formed in the hard mask layers and the BARC layer.

After the openings 301 and 303 have been formed, the remainingphotoresist layer (e.g., mask 302) may be removed by using suitablephotoresist stripping techniques such as chemical solvent cleaning,plasma ashing, dry stripping and/or the like. The photoresist strippingtechniques are well known and hence are not discussed in further detailherein to avoid repetition.

FIG. 4 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 3 after an etching process is applied to the substrate ofthe first semiconductor wafer in accordance with various embodiments ofthe present disclosure. After the photoresist mask has been removed by asuitable removal process, a suitable etching process, such as a dryetching, a wet etching or any other suitable patterning process may beapplied to the first substrate 102 of the first semiconductor wafer 110.During the etching process, the oxide layer 115 may function as a hardmask layer. As shown in FIG. 4, a plurality of openings 114 and 116 areformed in the first substrate 102. The etching process may be performedon the first substrate 102 until the first inter-metal dielectric layer104 is exposed. Subsequently, the oxide hard mask layer 115 may beremoved by a suitable removal process.

FIG. 5 illustrates a cross section view of the semiconductor deviceshown in FIG. 4 after another etching process is applied to thesemiconductor device in accordance with various embodiments of thepresent disclosure. A suitable etching process, such as a dry etch, ananisotropic wet etch, or any other suitable anisotropic etch orpatterning process, may be performed on the semiconductor device to formopenings 504 and 506. During the etching process, the poly layer 113 andthe metal lines 106, 108 and 206 may function as hard mask layers.

The openings 504 and 506 are respective extensions of the openings 114and 116 shown in FIG. 4. In particular, the openings 504 and 506 extendthrough the inter-metal dielectric layers 104 and 204 as well as thebonding interface of two stacked wafers. As shown in FIG. 5, the metallines 106, 108, 206 and 208 are exposed after the openings 504 and 506have been formed.

It should further be noted that the metal lines 106 and 108 are formedof suitable metal materials such as copper, which is of a differentetching rate (selectivity) from the inter-metal dielectric layers (e.g.,the inter-metal dielectric layers 104 and 204). As such, the metal lines106 and 108 may function as a hard mask layer for the etching process ofthe inter-metal dielectric layers 104 and 204. A selective etchingprocess may be employed to etch the inter-metal dielectric layers 104and 204 rapidly while etching only a portion of the metal lines 106 and108. As shown in FIG. 5, the exposed portion of the hard mask layer(e.g., metal lines 106 and 108) may be partially etched away, therebyforming a recess such as the recess 502 as shown in FIG. 5. The depth ofthe recess 502 may vary depending on a variety of applications anddesign needs.

FIG. 6 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 5 after the remaining poly layer has been removed inaccordance with various embodiments of the present disclosure. Duringthe etching process shown in FIG. 5, the poly layer 113 may be partiallyetched away or fully etched away. After the etching process, a suitableremoval process may be employed to remove the remaining portion of thepoly layer 113. As shown in FIG. 6, the top surface of the BARC layer112 is exposed after the poly layer 113 has been removed.

FIG. 7 illustrates a cross section view of the semiconductor deviceshown in FIG. 6 after a dielectric layer is deposited over thesemiconductor device in accordance with various embodiments of thepresent disclosure. As shown in FIG. 7, a dielectric layer 702 is formedover the bottoms and sidewalls of the openings 701 and 703. Furthermore,the dielectric layer 702 is formed over the top surface of thesemiconductor device as shown in FIG. 7.

The dielectric layer 702 may be formed of various dielectric materialscommonly used in integrated circuit fabrication. For example, thedielectric layer 702 may be formed of silicon dioxide, silicon nitrideor a doped glass layer such as boron silicate glass and the like.Alternatively, dielectric layer may be a layer of silicon nitride, asilicon oxynitride layer, a polyamide layer, a low dielectric constantinsulator or the like. In addition, a combination of the foregoingdielectric materials may also be used to form the dielectric layer 702.In accordance with some embodiments, the dielectric layer 702 may beformed using suitable techniques such as sputtering, oxidation, CVDand/or the like.

FIG. 8 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 7 after an etching process is applied to some portions ofthe dielectric layer in accordance with in accordance with variousembodiments of the present disclosure. The dielectric layer 702 may bepatterned and portions of the dielectric layer 702 may be removed. Asshown in FIG. 8, the remaining dielectric layer may include twoportions. The first portion is formed along the sidewalls of the bottomtrench. The second portion is formed along the sidewalls of the uppertrench. Throughout the description, the first portion is alternativelyreferred to as a first dielectric layer 801. The second portion isalternatively referred to as a second dielectric layer 803.

The removal process of some portions of the dielectric layer 702 may bea suitable etching process such as wet-etching, dry-etching and/or thelike. The detailed operations of either the dry etching process or thewet etching process are well known in the art, and hence are notdiscussed herein to avoid repetition.

FIG. 9 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 8 after a conductive material has been filled in theopenings in accordance with various embodiments of the presentdisclosure. In some embodiments, a plurality of auxiliary layers such asa seed layer may be deposited prior to a plating process, through whichthe conductive material is filled into the openings.

The seed layer (not shown) may be may be formed of copper, nickel, gold,any combination thereof and/or the like. The seed layer may be formed bysuitable deposition techniques such as PVD, CVD and/or the like.

Once the seed layer has been deposited in the openings, a conductivematerial, which includes tungsten, titanium, aluminum, copper, anycombinations thereof and/or the like, is filled into the openings,forming conductive plugs 902 and 904. In some embodiments, theconductive material may be filled in the openings through anelectroplating process.

FIG. 10 illustrates a cross section view of the semiconductor deviceshown in FIG. 9 after a CMP process is applied to the top surface of thesemiconductor device in accordance with various embodiments of thepresent disclosure. A planarization process, such as CMP, etch back stepand the like, may be performed to planarize the top surface of thesemiconductor device. As shown in FIG. 10, a portion of the conductivematerial has been removed as a result. As shown in FIG. 10, there may betwo conductive plugs 902 and 904 formed in the semiconductor deviceafter the CMP process is performed on the semiconductor device.

As shown in FIG. 10, each conductive plug (e.g., conductive plugs 902and 904) may comprise two portions. A first portion is from the metalline 206 to the hard mask layer formed by the metal lines 106 and 108.The first portion is of a width W1 as shown in FIG. 10. A second portionis from the hard mask layer to the backside of the first substrate 102.The second portion is of a width W2 as shown in FIG. 10. In someembodiments, W2 is greater than or equal to W1.

FIG. 11 illustrates a cross sectional view of the semiconductor deviceshown in FIG. 10 after a dielectric layer is formed on the semiconductordevice in accordance with various embodiments of the present disclosure.The dielectric layer 1102 may comprise commonly used dielectricmaterials, such as silicon nitride, silicon oxynitride, siliconoxycarbide, silicon carbide, combinations thereof, and multi-layersthereof. The dielectric layer 1102 may be deposited over thesemiconductor device through suitable deposition techniques such assputtering, CVD and the like.

The conductive plugs (e.g., conductive plug 902) include two portions asdescribed above with respect to FIG. 10. The portion from the hard masklayer (e.g., metal line 106) to the metal line 206 may be alternativelyreferred to as a three-dimensional structure 1115 throughout thedescription.

One advantageous feature of the stacked wafer having the conductiveplugs 902 and 904 shown in FIG. 11 is that the active circuits of bothsemiconductor wafers are connected to each other through a singleconductive plug (e.g., conductive plug 902). Such a single conductiveplug helps to further reduce form factor. Furthermore, in comparison tostacked semiconductor devices connected by multiple conductive plugs,the single conductive plug coupled between two semiconductor wafersshown in FIG. 11 helps to cut power consumption and prevent parasiticinterference.

It should be noted while FIG. 11 illustrates two semiconductor wafersstacked together, one skilled in the art will recognize that the stackedsemiconductor device shown in FIG. 11 is merely an example. There may bemany alternatives, variations and modifications. For example, thestacked semiconductor device may accommodate more than two semiconductorwafers.

FIG. 12 illustrates a cross sectional view of another stackedsemiconductor device in accordance with various embodiments of thepresent disclosure. The stacked semiconductor device 1200 is similar tothe stacked semiconductor device 100 shown in FIG. 11 except that thehard mask layer is formed by contacts, which is located adjacent to theinterface between the first substrate 102 and the inter-metal dielectriclayers 104.

The contacts may be formed in an inter-layer dielectric layer (notshown). The inter-layer dielectric layer may comprise a material such asboron phosphorous silicate glass (BPSG), although any suitabledielectrics may be used for either layer. The inter-layer dielectriclayer may be formed using a process such as PECVD, although otherprocesses may alternatively be used.

The contacts 1006 and 1008 may be formed through the inter-layerdielectric layer with suitable photolithography and etching techniques.Generally, these photolithography techniques involve depositing aphotoresist material, which is masked, exposed, and developed to exposeportions of the inter-layer dielectric layer that are to be removed. Theremaining photoresist material protects the underlying material fromsubsequent processing steps, such as etching.

The contacts 1006 and 1008 may comprise a barrier/adhesion layer (notshown) to prevent diffusion and provide better adhesion for the contacts1006 and 1008. In some embodiments, the contacts 1006 and 1008 may beformed of any suitable conductive material, such as a highly-conductive,low-resistive metal, elemental metal, transition metal, or the like. Inaccordance with an embodiment, the contacts 1006 and 1008 are formed oftungsten, although other materials, such as copper, aluminum and/or thelike, could alternatively be utilized. In an embodiment in which thecontacts 1006 and 1008 are formed of tungsten, the contacts 1006 and1008 may be deposited by CVD techniques known in the art, although anymethod of formation could alternatively be used.

As shown in FIG. 12, the conductive plugs (e.g., conductive plugs 1202and 1204) include two portions. The portion from the hard mask layer(e.g., contact 1006) to the metal line 206 may be alternatively referredto as a three-dimensional structure 1214 throughout the description.

FIG. 13 illustrates a cross sectional view of yet another stackedsemiconductor device in accordance with various embodiments of thepresent disclosure. The stacked semiconductor device 1300 is similar tothe stacked semiconductor device 100 shown in FIG. 11 except that theetching hard mask is formed by redistribution lines, which are locatedadjacent to the interface of two semiconductor wafers.

The redistribution lines 1306 and 1308 may be a single material layer,or a multi-layered structure and may be made of metals such as titanium,titanium nitride, aluminum, tantalum, copper and combinations thereof.The redistribution lines 1306 and 1308 may be made by any suitablemethod known in the art such as physical vapor deposition (PVD),sputter, CVD, electroplating and/or the like.

The conductive plugs (e.g., conductive plugs 1302 and 1304) include twoportions. The portion from the hard mask layer (e.g., redistributionlines 1306 and 1308) to the metal line 206 may be alternatively referredto as a three-dimensional structure 1314 throughout the description.

It should be noted that the first semiconductor wafer 110 may be bondedon the second wafer 210 through a suitable metal-dielectric bondingtechnique such as a copper-silicon oxide nitride (Cu-SiON) bondingprocess.

It should further be noted while FIG. 11, FIG. 12 and FIG. 13 illustratehard mask layers formed by metal lines, contacts and redistributionlines respectively, one skilled in the art will recognize that hard masklayers shown in FIGS. 11-13 are merely examples. There may be manyalternatives, variations and modifications. For example, the hard masklayer may be formed by a plurality of isolation regions, poly-siliconregions, any combinations thereof and/or the like.

FIG. 14 illustrates a cross sectional view of a backside illuminatedimager sensor including a stacked wafer structure in accordance withvarious embodiments of the present disclosure. The backside illuminatedimage sensor 1400 comprises two semiconductor wafers, namely a sensorwafer 1201 and an application-specific integrated circuit (ASIC) wafer1203. As shown in FIG. 14, the sensor wafer 1201 is stacked on top ofthe ASIC 1203. In some embodiments, the sensor wafer 1201 and the ASICwafer 1203 are connected to each other through suitablethree-dimensional structures such as the three-dimensional structure1115 shown in FIG. 11, the three-dimensional structure 1214 shown inFIG. 12, the three-dimensional structure 1314 shown in FIG. 13 and anycombinations thereof.

The ASIC wafer 1203 may comprise a plurality of logic circuits such aslogic circuits 1206 and 1208. In some embodiments, the logic circuitsmay be an analog-to-digital converter. However, the logic circuits maybe other functional circuits that may be utilized within a backsideilluminated image sensor. For example, the logic circuits 1206 and 1208may be a data processing circuit, a memory circuit, a bias circuit, areference circuit, any combinations thereof and/or the like.

The ASIC wafer 1203 may further comprise a plurality of interconnectionlayers and a plurality of metal lines 1220, 1222, 1224 and 1226 embeddedin the interconnection layers. The metal lines 1220, 1222, 1224 and 1226may function as interconnection structures. As indicated by the arrowsshown in FIG. 14, the metal lines 1220, 1222, 1224 and 1226 providesignal paths between logic circuits 1206 and 1208, and the sensor wafer1201.

The metal lines 1220, 1222, 1224 and 1226 may be made through anysuitable formation process (e.g., lithography with etching, damascene,dual damascene, or the like) and may be formed using suitable conductivematerials such as copper, aluminum, aluminum alloys, copper alloys orthe like.

The sensor wafer 1201 is fabricated by CMOS process techniques known inthe art. In particular, the sensor wafer 1201 comprises an epitaxiallayer over a silicon substrate. According to the fabrication process ofbackside illuminated image sensors, the silicon substrate has beenremoved in a backside thinning process until the epitaxial layer isexposed. A portion of epitaxial layer may remain. A p-type photo activeregion and an n-type photo active region (not shown respectively) areformed in the remaining epitaxial layer.

The photo active regions such as the p-type photo active region and then-type photo active region may form a PN junction, which functions as aphotodiode. As shown in FIG. 14, the imager sensor 1110 may comprise aplurality of photodiodes.

The sensor wafer 1201 may comprise a transistor (not shown). Inparticular, the transistor may generate a signal related to theintensity or brightness of light that impinges on the photo activeregions. In accordance with an embodiment, the transistor may be atransfer transistor. However, the transistor may be an example of themany types of functional transistors that may be utilized within abackside illuminated image sensor. For example, the transistor mayinclude other transistors located within a backside illuminated imagesensor, such as a reset transistor, a source follower transistor or aselect transistor. All suitable transistors and configurations that maybe utilized in an image sensor are fully intended to be included withinthe scope of the embodiments.

The sensor wafer 1201 may comprise a plurality of interconnection layersand metal lines embedded in the interconnection layers. The metal lines1120, 1122, 1124 and 1126 may provide signal paths between the sensorwafer 1201 and the ASIC wafer 1203. In particular, as indicated by thearrows shown in FIG. 14, an external signal may enter the backsideilluminated image sensor 1400 through the aluminum copper pad 1112, andthen reach the metal routing (e.g., metal line 1120) throughinterconnect structures such through vias (not shown). The externalsignal may further pass through a three-dimensional structure 1210. Thethree-dimensional structure 1210 may be the three-dimensional structure1115 shown in FIG. 11, the three-dimensional structure 1214 shown inFIG. 11, the three-dimensional structure 1314 shown in FIG. 13 and/orany combinations thereof.

After the external signal passes the three-dimensional structure 1210,the external signal may reach the logic circuit 1206 through the metalrouting (e.g., metal line 1220) of the ASIC wafer 1203.

When a signal leaves the logic circuit 1206, it reaches the image sensor1110 through a conductive path formed by the metal routing (e.g., metalline 1222) of the ASIC wafer 1203, the three-dimensional structure 1210,the metal routing (e.g., metal line 1122) of the sensor wafer 1201.

After the image sensor 1110 generates a signal, the signal is sent tothe logic circuit 1208 through a path formed by the metal routing (e.g.,metal line 1124) of the sensor wafer 1201, the three-dimensionalstructure 1210, the metal routing (e.g., metal line 1224) of the ASICwafer 1203. Furthermore, the signal may be sent outside of the backsideilluminated image sensor 1400 from the logic circuit 1208 through a pathformed by the metal routing (e.g., metal line 1226) of the ASIC wafer1203, the three-dimensional structure 1210, the metal routing (e.g.,metal line 1126) of the sensor wafer 1201 and the aluminum copper pad1114.

The logic circuit 1206 and 1208 may be coupled to aluminum copper pads1112 and 1114. As shown in FIG. 14, the aluminum copper pads 1112 and1114 may be formed on the backside of the sensor wafer 1201.

It should be noted that the location of the aluminum copper pads 1112and 1114 shown in FIG. 14 is merely an example. A person skilled in theart will recognize that there may be many alternatives, modificationsand variations. For example, the aluminum copper pads 1112 and 1114 maybe formed on the non-bonding side of the ASIC wafer 1203. The formfactor of a backside illuminated image sensor can be reduced by formingthe aluminum copper pads 1112 and 1114 on the non-bonding side of theASIC wafer 1203.

One advantageous feature of having input/output terminals formed on thenon-bonding side of the ASIC wafer 1203 is that the density as well asquantum efficiency of the backside illuminated image sensor 1400 can beimproved as a result.

FIG. 15 illustrates a top view of the hard mask in accordance withvarious embodiments of the present disclosure. As described above withrespect to FIG. 11, FIG. 12 and FIG. 13, the hard mask layers may beformed by metal lines, contacts and redistribution lines respectively.While the cross sectional view 1501 shows the hard mask layer includestwo portions (e.g., metal lines 106 and 108), these two portions may befrom a continuous ring shaped region as illustrated by the top view1502. The top view 1502 of the hard mask layer shows the hard mask layeris of a ring shape. The inside diameter of the ring shaped hard masklayer is denoted as W1.

It should be noted that the internal circle of the ring shaped hard masklayer can be replaced by other suitable shapes such as a square as shownby the top view 1504. It is within the scope and spirit of variousembodiments of the present disclosure that the top view of the hard masklayer may comprise other shapes, such as, but no limited to oval,triangular, polygonal and/or the like.

FIG. 16 illustrates another top view of the hard mask in accordance withvarious embodiments of the present disclosure. The top views of FIG. 16are similar to those shown in FIG. 15 except that the ring shape isreplaced by a square with an opening. The top view 1602 shows a squarewith a square shaped opening. The top view 1604 shows a square with acircular shaped opening.

In accordance with an embodiment, a method comprises bonding a firstsemiconductor chip on a second semiconductor chip, applying an etchingprocess to the first semiconductor chip and the second semiconductorchip until a metal surface of the second semiconductor chip is exposed,wherein as a result of applying the etching process, an opening isformed in the first semiconductor chip and the second semiconductor chipand plating a conductive material in the opening to from a conductiveplug.

In accordance with an embodiment, a method comprises bonding a firstsemiconductor chip on a second semiconductor chip, applying an etchingprocess to the first semiconductor chip and the second semiconductorchip until a metal surface of the second semiconductor chip is exposed,forming an opening extending through the first semiconductor chip andpartially through the second semiconductor chip, wherein a portion ofthe opening is surrounded by a conductive element of the firstsemiconductor chip, the portion comprising two different widths andplating a conductive material in the opening to from a conductive plug.

In accordance with an embodiment, a method comprises bonding a firstsemiconductor chip on a second semiconductor chip, wherein aninterconnect structure of the first semiconductor chip is in contactwith an interconnect structure of the second semiconductor chip,applying an etching process to the first semiconductor chip and thesecond semiconductor chip until an interconnect element of the secondsemiconductor chip is exposed, forming an opening extending through thefirst semiconductor chip and partially through the second semiconductorchip, wherein the opening extends into an interconnect element of thefirst semiconductor chip and plating a conductive material in theopening to from a conductive plug.

Although embodiments of the present invention and its advantages havebeen described in detail, it should be understood that various changes,substitutions and alterations can be made herein without departing fromthe spirit and scope of the invention as defined by the appended claims.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present invention. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, or steps.

What is claimed is:
 1. A method comprising: bonding a firstsemiconductor chip on a second semiconductor chip; applying an etchingprocess to the first semiconductor chip and the second semiconductorchip until a metal surface of the second semiconductor chip is exposed,wherein as a result of applying the etching process, an opening isformed in the first semiconductor chip and the second semiconductorchip; and plating a conductive material in the opening to from aconductive plug.
 2. The method of claim 1, wherein: the opening includesa first portion extending through a boundary of the first semiconductorchip and the second semiconductor chip, a second portion surrounded by ametal element of the first semiconductor chip, a third portion extendinginto the metal element and fourth portion over the metal element.
 3. Themethod of claim 2, wherein: the metal element is a metal line of thefirst semiconductor chip; and the metal surface of the secondsemiconductor chip is a surface of a metal line of the secondsemiconductor chip.
 4. The method of claim 2, wherein: a width of thefirst portion is substantially equal to a width of the second portion; awidth of the third portion is greater than the width of the secondportion; and a width of the fourth portion is substantially equal to thewidth of the third portion.
 5. The method of claim 2, furthercomprising: depositing a first dielectric layer on bottoms and sidewallsof the opening; and removing the first dielectric layer on a bottom ofthe first portion and a bottom of the third portion.
 6. The method ofclaim 5, wherein: as a result of performing the step of removing thefirst dielectric layer, the first dielectric layer becomes adiscontinuous layer including a first sidewall portion and a secondsidewall portion.
 7. The method of claim 1, further comprising: applyinga chemical mechanical polish process until a topmost surface of theconductive plug is level with a backside surface of the firstsemiconductor chip.
 8. The method of claim 7, further comprising: afterthe step of applying the chemical mechanical polish process, forming asecond dielectric layer over the conductive plug, wherein the topmostsurface of the conductive plug is completely covered by the seconddielectric layer.
 9. The method of claim 1, wherein: at least a portionof the conductive plug is surrounded by an anti-reflection coatinglayer.
 10. A method comprising: bonding a first semiconductor chip on asecond semiconductor chip; applying an etching process to the firstsemiconductor chip and the second semiconductor chip until a metalsurface of the second semiconductor chip is exposed; forming an openingextending through the first semiconductor chip and partially through thesecond semiconductor chip, wherein a portion of the opening issurrounded by a conductive element of the first semiconductor chip, theportion comprising two different widths; and plating a conductivematerial in the opening to from a conductive plug.
 11. The method ofclaim 10, wherein: the first semiconductor chip and the secondsemiconductor chip are bonded together through a direct bonding process.12. The method of claim 11, wherein: during the direct bonding process,bonding pads of the first semiconductor chip are aligned face-to-facewith respective bonding pads of the second semiconductor chip.
 13. Themethod of claim 10, wherein: a first portion of the opening extendsthrough a metal line of the first semiconductor chip; and a secondportion of the opening extends into the metal line of the firstsemiconductor chip.
 14. The method of claim 13, wherein: a width of thesecond portion of the opening is greater than a width of the firstportion of the opening.
 15. The method of claim 10, wherein: at least aportion of the conductive plug protrudes over a backside of the firstsemiconductor chip.
 16. A method comprising: bonding a firstsemiconductor chip on a second semiconductor chip, wherein aninterconnect structure of the first semiconductor chip is in contactwith an interconnect structure of the second semiconductor chip;applying an etching process to the first semiconductor chip and thesecond semiconductor chip until an interconnect element of the secondsemiconductor chip is exposed; forming an opening extending through thefirst semiconductor chip and partially through the second semiconductorchip, wherein the opening extends into an interconnect element of thefirst semiconductor chip; and plating a conductive material in theopening to from a conductive plug.
 17. The method of claim 16, furthercomprising: forming an anti-reflection coating layer over and in contactwith a backside of the first semiconductor chip, wherein at least aportion of the conductive plug is surrounded by the anti-reflectioncoating layer.
 18. The method of claim 16, wherein: the interconnectelement of the first semiconductor chip is a metal line.
 19. The methodof claim 16, wherein: the interconnect element of the firstsemiconductor chip is a metal contact in contact with a substrate of thefirst semiconductor chip.
 20. The method of claim 16, wherein: theinterconnect element of the first semiconductor chip is a redistributionline in contact with the second semiconductor chip.